Samsung's next-generation Exynos 2700 processor, expected to power select Galaxy S27 and S27 Plus models in 2026, may face a surprising thermal challenge. According to a recent report from Korean outlet Sisa-Journal, Samsung is contemplating the elimination of a key advanced packaging technique called Fan-Out Wafer-Level Packaging (FOWLP) from the Exynos 2700's manufacturing process. This decision, driven by high costs and low yield rates, could cause the chip to run hotter than its predecessors. However, the company is also implementing new cooling technologies that might mitigate the effects, leaving enthusiasts and industry observers wondering whether the trade-offs will be acceptable.
What is FOWLP and why does it matter?
Fan-Out Wafer-Level Packaging is a semiconductor packaging method that allows multiple components (like the CPU, GPU, and memory) to be integrated into a single package without the need for a traditional substrate. By placing the die on a reconstituted wafer and then creating interconnects that fan out from the chip, FOWLP reduces electrical path lengths, improves signal integrity, and, crucially, enhances thermal dissipation. When Samsung first adopted FOWLP for the Exynos 2400 in 2023, the company claimed a 23% improvement in heat resistance for single-core tasks and an 8% improvement for multi-core workloads. This translated to lower operating temperatures and better sustained performance under load.
The packaging process is particularly important for high-performance mobile processors, which generate significant heat during gaming, video recording, or AI processing. Without effective thermal management, the chip can throttle its clock speeds to prevent damage, leading to reduced performance and a less fluid user experience. By dropping FOWLP, the Exynos 2700 could lose one of its primary thermal advantages, especially when compared to competitors like Qualcomm's Snapdragon 8 series, which often employ similar advanced packaging techniques.
The cost and yield dilemma
The decision to potentially abandon FOWLP is rooted in economics. An industry source quoted in the report explained: “I heard that while applying WLP to flagship Exynos chips was effective in terms of performance and thermal management, it did not generate much profit because the packaging itself became very complex and the yield risk was high. If the volume were large, profitability could be covered to some extent, but currently, since it is only being applied to a portion of the MX business unit’s own models, the cost burden is bound to be heavy.”
Samsung's Mobile eXperience (MX) division uses Exynos chips in only a fraction of its global smartphone shipments. Typically, Galaxy S series devices sold in markets like Korea, Europe, and select Asian countries use Exynos, while the US, China, and other regions get Qualcomm Snapdragon variants. This limited volume makes it difficult for Samsung to amortize the high cost of FOWLP, especially when yield rates are lower than desired. By reverting to a more conventional packaging approach, Samsung can reduce manufacturing complexity and improve profitability, albeit at the risk of thermal performance.
This is not the first time Samsung has faced such a trade-off. The Exynos 2200, which introduced AMD RDNA2-based GPU, suffered from thermal and efficiency issues partly due to packaging limitations. Samsung subsequently invested heavily in FOWLP for the Exynos 2400, which showed marked improvements. Now, with the Exynos 2700, the company appears to be walking a fine line between cost control and performance.
Cooling measures that could offset the heat
Even without FOWLP, Samsung is not leaving the Exynos 2700's thermal management entirely to chance. The report highlights two other cooling innovations that could help compensate. First, the Exynos 2700 is expected to feature a heat-path block (HPB), a built-in heat sink that was introduced on the Exynos 2600. This component sits directly on top of the processor die and draws heat away from critical hotspots. The HPB is made from a high-thermal-conductivity material, likely copper or a graphite composite, and its placement is optimized to maximize heat transfer to the phone's chassis or cooling system.
Second, and perhaps more importantly, Samsung is planning to rearrange the physical layout of the Exynos 2700's memory. Instead of stacking the DRAM directly on top of the processor (a common practice in high-end chips), the company will place the DRAM next to the processor, side-by-side. This change allows the HPB to cover both the CPU and DRAM simultaneously, ensuring that heat generated by the memory cells is also efficiently dissipated. In contrast, when DRAM is stacked on top, the heat from the processor must pass through the memory layers, which can act as an insulator. The side-by-side arrangement eliminates this bottleneck and improves overall heat management.
These two measures could potentially bring thermal performance back in line with what FOWLP offered, but the combined effect is uncertain. Without actual testing data, we only have theoretical analysis. Some experts believe that the combination of HPB and side-by-side DRAM could actually outperform FOWLP in some aspects, especially if the HPB is large enough and the DRAM placement reduces thermal cross-talk. Others argue that no amount of internal heatsinking can fully replace the inherent thermal benefits of advanced packaging.
Historical context: Samsung's Exynos thermal struggles
Samsung's Exynos chips have a long history of thermal issues, particularly in the Galaxy S series. The Exynos 990 (Galaxy S20) was notorious for overheating during 4K video recording and gaming, leading to aggressive throttling. The Exynos 2100 (Galaxy S21) made improvements but still lagged behind the Snapdragon 888 in sustained performance. It wasn't until the Exynos 2200 (Galaxy S22) that Samsung began to seriously address thermal management, despite that chip's own efficiency problems. The Exynos 2400 represented a significant leap thanks to FOWLP and a refined architecture, and it was well-received in terms of heat and battery life.
Now, with the Exynos 2700 seemingly stepping back from FOWLP, the brand risks returning to a state where some Galaxy users (particularly those in Exynos markets) experience inferior thermal performance compared to Snapdragon variants. This could reignite the controversy that has plagued Samsung for years, where users in different regions receive different performance levels based on the chipset version. However, Samsung's ongoing investment in alternative cooling technologies, including vapor chambers and graphite sheets in its phones, could further alleviate the issue at the device level.
What this means for Galaxy S27 performance
The Galaxy S27 series, expected in early 2027, will consist of three models: the standard S27, S27 Plus, and S27 Ultra. According to current rumors, the Exynos 2700 will power the smaller two models in select markets, while the Ultra will use a Snapdragon chip globally. This segmentation puts extra pressure on Samsung to ensure that the Exynos variant offers comparable performance and thermal behavior to the Snapdragon version. If the Exynos 2700 runs significantly hotter, it could lead to throttling during demanding tasks, shorter battery life, and user dissatisfaction.
On the positive side, Samsung's new foundry process for the Exynos 2700 is expected to be the 3nm GAA (Gate-All-Around) technology, which offers better power efficiency than the 4nm process used for the Exynos 2400. This improved efficiency could partially offset the loss of FOWLP by generating less heat in the first place. Additionally, the chip is rumored to feature a new CPU core design from ARM (likely Cortex-X5 and Cortex-A7xx series) that balances performance and power consumption. The GPU, possibly based on AMD's RDNA3 architecture, will also play a role in thermal output.
Ultimately, the success of the Exynos 2700 will depend on how well these various factors balance out. Samsung has learned from past mistakes and is unlikely to release a chip that is a clear step backward. The reported measures suggest a thoughtful approach to thermal management, but only final hardware will tell the real story. For now, enthusiasts should remain cautiously optimistic, and we will provide updates as more information emerges from supply chain sources or official Samsung announcements.
In summary, Samsung's potential decision to drop FOWLP from the Exynos 2700 carries both risks and rewards. The company aims to cut costs and improve yields, but it must ensure that its alternative cooling solutions are sufficient to maintain performance and user experience. As the smartphone industry continues to push for more powerful processors in thinner devices, thermal design remains a critical battleground. Samsung's choices for the Galaxy S27 will be closely watched by both consumers and competitors alike.
Source: Android Authority News